An international conference exploring the future of China in the global electronics design and manufacturing world opened today in Shenzhen featuring presentations and appearances by many of the industry’s top executives as well as Chinese government officials.
Dubbed the Global Double Summits and organized by ASPENCORE, publisher of EE Times, EDN, EPSNews and other leading technology publications, the conference is exploring a range of topics related to events in the global economy and how Chinese enterprises and others are exploiting opportunities in the technology market.
Under the theme of this year’s Global CEO Summit, “Intelligent China,” speeches, presentations and discussions had a heavy focus on AI — with other hot technology topics such as Augmented Reality, Machine Learning, Cloud Computing, IoT and supply chain innovations.
This year’s Double Summits are the first in a series planned by ASPENCORE, according to Yorbe Zhang, interim publisher of the technology publishing and marketing company. Speakers at this year’s event are drawn from the leading technology companies, medium-size players and start-ups that are roiling the market with innovative technologies.
“The Double-Summits were so named because there are two parts to the event,” Zhang said. “On the first day we are holding the Global CEO Summit where industry executives will discuss issues of major significance to the industry in a frank and collegial environment. On the second day we will host the Global Distribution & Supply Chain Summit where executives will talk about opportunities and challenges in the manufacturing, component procurement and fulfilment segment of the electronics industry.”
Speakers at the event this year include:
Dr. Wei Shaojun, President, IC Design Branch, China Semiconductor Industry Association
Victor Peng, President & CEO, Xilinx
Jean-Marc Chery, President & CEO, STMicroelectronics
Tyson Tuttle, CEO, Silicon Labs
Nicky Lu, CEO, Etron Technology; President, Taiwan Semiconductor Industry Association
Paul Boudre, CEO, SOITEC
Maurice Geraets, Managing Director NXP Netherlands & Vice President Innovation
Allen Wu, Executive Chairman and CEO, Arm China
José Franca, Partner, Keensight Capital; Full Professor, Instituto Superior Técnico; Founder, Chipidea; Former State Secretary of Education, Portugal
Wayne Dai, Chairman, President & CEO, Verisilicon
Luca Verre, CEO, Prophesee
The executives’ speeches were followed by a roundtable discussion moderated by Junko Yoshida, global co-editor-in-chief of ASPENCORE, “China’s Role in the Next Big Thing.” The focus of the discussions ranged from China’s opportunity in AI field to the global electronics industry’s concerns about the U.S.-China trade war. Panelists included Jerry Fan, president, Analog Devices China; James Liu, vice president and general manager China, Imagination Technologies; Jack Qi Shu, executive vice president, HLMC; David X D Yang, chairman and CEO, ZGMicro; and Sassine Ghazi, co-general manager Design Group, Synopsys.
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